Technology: Packaging and integration

Overview Transducers Electronics Packaging Software Applications

Large area transducers

– laser release, flexible interconnects, substrate influence

Enhanced Roll-to-Roll assembly process

– printing, deposition, pick&place, curing

Improved heterogeneous integration scheme (FOWLP)

– airborne and underwater ultrasonic MEMS devices with ink-jet interconnects

Material and package characterization for large scale integration

– selection of suitable combination of transducers, materials and frequencies